Detail-oriented Product Quality Engineer with hands-on experience in wirebonding processes within semiconductor/electronics manufacturing. Skilled in monitoring and optimizing wirebond parameters (ball bonding, wedge bonding, loop height, pull/shear testing) to ensure high reliability and electrical performance. Experienced in working cross-functionally with process, equipment, and design teams to maintain quality standards and support new product introductions (NPI)
Experience: Less than 6 months
Performs different data analysis like CPK, PPK, Capability Attribute of Data, to have a good quality output in the production line
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